PCBA processing belongs to precision machining, and incorrect operating methods can directly affect the final quality of PCBA, such as component damage, connector breakage, PCBA damage, functional short circuit, external wear, and so on.

So, we must strictly pay attention to the following points during the processing:

1. Keep the operating environment clean and tidy, whether it is the SMT SMT production line or the DIP plugin workbench. Do not place any items with dust or fur, as well as food, especially smoking.

2. As industry common sense, it is not advisable to hold the surface of the welded PCBA with bare hands, as the oil secreted by the human body can affect its weldability.

3. Try to minimize the steps of PCBA production. If gloves get dirty during the operation, they should be replaced in a timely manner to avoid external pollution.

4. PCBA boards must not be stacked. During operation, personnel stack circuit boards in multiple layers to save time and effort. This can easily cause physical wear and tear between circuit boards, seriously affecting functional performance.

5. Do a good job of electrostatic discharge treatment. During the PCBA processing, static electricity poses a significant threat to electronic components, and in severe cases, it can lead to component failure. So, when in contact with the circuit board, it is necessary to wear static clothing, static shoes, etc.

The above are some operating standards in PCBA processing. Additionally, it is important to note that:

1. Quality assurance of solder paste. In the entire processing process, the quality of solder paste directly affects the quality of the product. Therefore, many details should be paid attention to during storage and use, such as the temperature of refrigeration, the temperature and humidity during the printing process, and the time for reheating.

2. SMT surface mount processing is a very important part of the PCBA manufacturing process. The temperature curve control of reflow soldering plays a very important role in the welding quality of PCBA boards in the later stage. So, temperature is a point that needs special attention.

3. The post soldering of DIP plugins can be said to be the final step in circuit board processing. This process is prone to welding defects such as continuous tin, insufficient tin, and lack of tin, so temperature control and furnace quality of wave soldering should be given special attention.